Folgoplas

Folgoplast
Detailed description:

The substrate under a laminate, a heat - insulated floor will provide sound and thermal isolation in the range of temperatures from - 60 to + 100 °C at relative humidity of air to 100% . The substrate represents a penopolietilenovy product on the basis of the made foam polyethylene which is intended for thermal insulation, sound insulation in rooms and in the open air on condition of full protection against hits of direct sunshine. Material can be also recommended for application as sound insulation in building constructions at the device of floating floors with increased requirements to isolation of shock noise. Thanks to the lowest indicator of heat conductivity among heat - insulating materials, and also to exclusive properties of sound insulation, a cloth objectively the best material for warming of a floor, thermal insulation of a roof, walls, etc. The substrate keeps within under a laminate, a parquet, linoleum, floor plates, on concrete coverings, wooden floors and allows to level a floor surface, and also to considerably increase acoustic isolation.

The reflecting thermal insulation of Folgoplast - consists of the made foam polyethylene laminated on the one hand by the metallized polypropylene film. A basis - the made foam polyethylene possessing high heat - insulating properties. An external layer - the aluminum foil protected by a polypropylene film. The polypropylene film has the high mechanical durability and resistance to influence of alkalis, acids and organic solvents, thanks to it, the reflecting layer is reliably protected from oxidation and mechanical damages.

For Folgoplastov are characteristic:

• resistance to change of temperatures,
• zero water absorption,
• ideal vapor barrier,
• high reflective ability,
• ecological purity,
• durability,
• the low price of the made foam polyethylene
• ideal warm, shumo - , waterproofing,
• resistance to influence of alkalis, acids, etc. ,
• good sound absorption,
• elimination of roughnesses of the basis,
• low heat conductivity.